Jetfgo circuits Group Limited
Jetfgo circuits Group Limited established in 2004, is located in Fuyong Town, Bao'an District, Shenzhen. It is a professional manufacturer of prototype and small volume and medium batch. After 20 years of development, the company has an experienced management team and a strong engineering R&D team. The company is equipped with advanced production equipment, superb technical ability and perfect quality management system. The company has qualified UL certification (UL file No.: E218213), ISO9001:2015, ISO14001:2015, CQC, IATF16949:2016.
After20 years of development, the company has an experienced management team and a strong engineering R&D team. The company is equipped with advanced production equipment, has superb technical capabilities and a complete quality management system. The company's products are widely used in communications, industrial control, computers, military industry, medical care, aviation, automotive, consumer electronics and other fields. With the requirements of PCB refinement, the company vigorously develops multi-layer and HDI boards. Gradually formed a pattern dominated by multi-layer boards, HDI boards and high-frequency boards. The prototype can be built up to 60 layers, with a monthly production capacity of 25,000 square meters.
ABOUT US
Annual Revenue in 2021: 580 million RMB
Factories: 4+
Monthly production capacity: 20000+ ㎡
Active employees: 1200+
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APPLICATIONS
Communication
Equipment
Industrial control
Military Equipment
Automotive Electronics
Medical machinery
Customized Power supply
Security electronics
The internet of things
NEWS
2026-1-29
The 2026 annual event came to a successful conclusion!
Deputy General Manager (Liu Zaiping) fondly recalled the fruitful achievements the company...
2025-9-18
A wonderful review of the September birthday party
September Employee Birthday Party Thank you for having you...
2024-11-12
Chairman Yin and his team visited for inspection and exchange-Shenzhen JETFGO Circuits Co.,Ltd.
On the morning of November 9, 2024...
Immersion Gold Line
Jetfgo’s advanced LDI, CNC milling, drilling, electroplating, and lamination systems form the backbone of our high-precision manufacturing. These capabilities enable complex PCB features such as Blind & Buried Vias, Via-in-Pad, Sideplating, Countersunk Holes, and tight Impedance Control — ensuring every layer delivers performance and reliability.
Lamination Machine
Jetfgo’s advanced LDI, CNC milling, drilling, electroplating, and lamination systems form the backbone of our high-precision manufacturing. These capabilities enable complex PCB features such as Blind & Buried Vias, Via-in-Pad, Sideplating, Countersunk Holes, and tight Impedance Control — ensuring every layer delivers performance and reliability.
LDI Machine
Jetfgo’s advanced LDI, CNC milling, drilling, electroplating, and lamination systems form the backbone of our high-precision manufacturing. These capabilities enable complex PCB features such as Blind & Buried Vias, Via-in-Pad, Sideplating, Countersunk Holes, and tight Impedance Control — ensuring every layer delivers performance and reliability.
EQUIPMENT ADVANTAGE
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