High Frequency Board

Number of layers: 2

Plate: Rogers5880

Surface treatment: Shenjin

Power Plate thickness: 0.15mm

Minimum hole: 0.25mm

Line width line distance: 3.9 / 3.9mil

Process: Local Power 120 micro inches

High Frequency Board

Layers: 2

Material: Rogers4003

Surface Finish: ENIG

Board Thickness: 1.6mm

Minimum Hole: 0.2mm

High Frequency Board

Layers: 2

Material: Rogers 5880

Surface Finish: ENIG+Hard Gold

Board Thickness: 0.15mm

Minimum hole: 0.25mm

Line Width & Space: 6 / 6mil

Special Technology: Hard Gold thickness is 120 micro inches

High Frequency Board

Layers: 2

Material: Rogers4350

Surface Finish: ENIG

Board Thickness: 1.6mm

Minimum Hole: 0.2mm

Line Width & Space: 3.5 / 3.5mil

Special Technology: High Frequency, Half Hole

High Frequency Board

Layers: 6

Material: FR-4 Rrogers4350 S

urface Finish: ENIG

Sheet thickness: 1.6mm

Minimum Hole:0.3mm

Special Technology: High Frequency, 3 Step HDI

High Speed Board

Layers: 12

Material: FR-4 Panasonic M6

Surface Finish: ENIG

Board Thickness: 2mm

Minimum Hole: 0.2mm

Line Width & Space: 4 / 4MIL

Special Technology: 3 Step HDI, Impedance

High Speed Board

Layers: 24

Material: FR-4 Panasonic M6

Surface Finish:ENIG

Board Thickness: 3mm

Minimum Hole: 0.25mm

Line Width Space: 3.5 / 3.5mil

High Speed Board

Layers: 18

Material: FR-4 TU872-SLK

Surface Finish: ENIG

Board Thickness: 2mm

Minimum Hole: 0.2mm Line Width

Space: 3 / 4mil Special Technology: 2 step HDI, Impedance