Jetfgo factory has a R&D team with full-time engineers. The population of technical staff to total employees is 18%, In the process of technological development, the overcoming challenges gradually promote technological accumulation. and the Sufficient resources of special material and special production methods are provided for researching, contribute to the technology innovation.
R&D capability
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Process Capability
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| Items | Prototype | Standard |
| Layers | 1-60 Layers | 1-32 Layers |
| Max. Panel Size | 1200*540mm | 610*540mm |
| Board Thickness | 0.2-8.0mm | 0.4-6.0mms |
| Copper Thickness | 1/3-24OZ | 1/3-16OZ |
| Min. Line Width&space | 3/2.5mil | 3/3mil |
| Max. Aspect Ratio | 20:1 | 16:1 |
| Min. Mechanical Hole | 0.15mm | 0.25mm |
| PTH Hole Tolerance | ±0.05mm | ±0.075mm |
| NPTH Hole Tolerance | ±0.05mm | ±0.05mm |
| Outline Tolerance | ±0.08mm | ±0.1mm |
| Min. Laser Hole | 0.075mm | 0.1mm |
| Min. Solder Dam | 3mil | 4mil |
| Min. Impedance Tolerance | ±5% | ±10% |
| Soldmask Color | Green/White/Black/Blue/Red/Yellow/Matt | |
| Surface Finish | HASL (LF), ENlG, lmmersion Tin, lmmersion silver, Golden finger, Full board with hard gold plating, OSP, ENEPlG, Selective hard gold plating. | |
| Base Material | FR-4 TG150/TG170, Rogers, Arlon, Taconic, TUC TU-872 SLK, TU-883,Panasonic M6/M7, Bergguist etc. | |
Quality Control-Flow Chart
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TECHNOLOGY
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