Computer board
Layers: 14layers Boards
thickness: 1.6mm
Dimensions: 275*120mm
Main control package: BGA-256
Minimun component: 0402
Component Qty: 3600+
Process features: Top-side BGA, assembly process, gold finger protection, POP assembly process,THT through-hole reflow process. 工艺特点: 正面BGA贴装工艺, 金手指防护, POP贴装工艺, THT通孔回流工艺
Computer board
Layers: 8layers
Boards thickness: 1.6mm
Dimensions: 290*130mm
Main control package: BGA-256
Minimun component: 0201
Component Qty: 6100+
Process features: Dense IC components on the top side,numerous BGAs/QFPs, POP assembly process,THT through-hole reflow process. 工艺特点: 正面IC元件密集,BGA/QFP多,POP贴装工艺,THT通孔回流工艺
PRODUCTS
Communication module board
Layers: 8layers
Boards thickness: 1.0mm
Dimensions: 150*150mm
Main control package: FBGA-900
Minimun component: 0201
Component Qty: 800+
Process features: Dense components on both side, numerous BGAs, CNC board separation. 工艺特点: 双面元器件密集, BGA多, CNC分板
Server board
Layers: 12layers
Boards thickness: 2.0mm
Dimensions: 340*400mm
Main control package: Dual-channel BGA-1024
Minimun component: 0201
Component Qty: 9000+
Process features: Dense components on the top side, numerous BGAs/QFPs, POP assembly process, heat sink assembly. 工艺特点: 正面元器件密集, BGA/QFP多, POP贴装工艺, 散热片组装.
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