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High Speed Board

Layers: 24
Material: FR-4 Panasonic M6
Surface Finish:ENIG
Board Thickness: 3mm
Minimum Hole: 0.25mm
Line Width Space: 3.5 / 3.5mil
Special Technology: Via in PAD, Back drilling, Depth milling, Impedance

Product Details

Surface finishes： HASL (LF), ENlG, lmmersion Tin, lmmersion silver, Golden finger, Full board with hard gold plating, OSP, ENEPlG, Selective hard gold plating.

Regular materials： FR-4 TG150/TG170, Rogers, Arlon, Taconic, TUC TU-872 SLK, TU-883,Panasonic M6/M7, Bergguist etc.

Special technologies： Blind & buried vias, POFV, edge plating, castellated holes, step mounting holes, controlled depth holes, metal based (core), step gold finger, back drill,partial hybrid pressing, bus bar, embedded coin, embedded ceramic etc.

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