Communication.module

Communication.module

ꁆ ꁇ

Communication module board

Layers: 8layers
Boards thickness: 1.0mm
Dimensions: 150*150mm
Main control package: FBGA-900
Minimun component: 0201
Component Qty: 800+
Process features: Dense components on both side, numerous BGAs, CNC board separation.
工艺特点: 双面元器件密集, BGA多, CNC分板

Product Details

Surface finishes： HASL (LF), ENlG, lmmersion Tin, lmmersion silver, Golden finger, Full board with hard gold plating, OSP, ENEPlG, Selective hard gold plating.

Regular materials： FR-4 TG150/TG170, Rogers, Arlon, Taconic, TUC TU-872 SLK, TU-883,Panasonic M6/M7, Bergguist etc.

Special technologies： Blind & buried vias, POFV, edge plating, castellated holes, step mounting holes, controlled depth holes, metal based (core), step gold finger, back drill,partial hybrid pressing, bus bar, embedded coin, embedded ceramic etc.

Return to Product

Related Products

High Frequency Board

Layers: 6
Material: FR-4 Rrogers4350
Surface Finish: ENIG
Sheet thickness: 1.6mm
Minimum Hole:0.3mm
Special Technology: High Frequency, 3 Step HDI

High Frequency Board

Number of layers: 2
Plate: Rogers5880
Surface treatment: Shenjin Power
Plate thickness: 0.15mm
Minimum hole: 0.25mm
Line width line distance: 3.9 / 3.9mil
Process: Local Power 120 micro inches

High Frequency Board

Layers: 2
Material: Rogers4350
Surface Finish: ENIG
Board Thickness: 1.6mm
Minimum Hole: 0.2mm
Line Width & Space: 3.5 / 3.5mil
Special Technology: High Frequency, Half Hole

High Frequency Board

Layers: 2
Material: Rogers4003
Surface Finish: ENIG
Board Thickness: 1.6mm
Minimum Hole: 0.2mm

High Frequency Board

Layers: 2
Material: Rogers 5880
Surface Finish: ENIG+Hard Gold
Board Thickness: 0.15mm
Minimum hole: 0.25mm
Line Width & Space: 6 / 6mil
Special Technology: Hard Gold thickness is 120 micro inches

High Frequency Board

Layers: 2
Material: Rogers 5880
Surface Finish: ENIG
Board Thickness: 0.3mm
Minimum hole: 0.15mm
Line Width & Space: 3.5 / 3.5mil
Special Technology: Copper filling in hole

Industrial Board

Layers: 12
Material: FR-4
Surface Finish: ENIG
Board Thickness: 1.6mm
Minimum Hole: 0.2mm
Line Width & Space: 3.6 / 3.6mil
Special Technology: Resin plugging & Impedance

Automotive Board

Layers: 8
Material: FR-4 S1000-2M
Surface Finish: ENIG
Board Thickness: 4.5mm
Minimum Hole: 0.4mm
Line Width & Space: 8/ 9mil
Special Technology: Resin plugging & Heavy copper

Industrial Board

Layers: 10
Material: FR-4
Surface Finish: ENIG
Board Thickness: 4.3mm
Minimum Hole: 0.5mm
Line Width & Space: 6 / 6mil
Special Technology: Depth milling, Impedance, Press fit hole

Computer Board

Layers: 8
Material: FR-4
Surface Finish: ENIG
Board Thickness: 1.1mm
Line Width & Space: 4/2.5mil
Special Technology: Half Hole

High Speed Board

Layers: 24
Material: FR-4 Panasonic M6
Surface Finish:ENIG
Board Thickness: 3mm
Minimum Hole: 0.25mm
Line Width Space: 3.5 / 3.5mil
Special Technology: Via in PAD, Back drilling, Depth milling, Impedance

High Speed Board

Layers: 18
Material: FR-4 TU872-SLK
Surface Finish: ENIG
Board Thickness: 2mm
Minimum Hole: 0.2mm
Line Width Space: 3 / 4mil
Special Technology: 2 step HDI, Impedance

High Speed Board

Layers: 12
Material: FR-4 Panasonic M6
Surface Finish: ENIG
Board Thickness: 2mm
Minimum Hole: 0.2mm
Line Width & Space: 4 / 4MIL
Special Technology: 3 Step HDI, Impedance

Heavy Copper Board

Layers: 16
Material: FR-4 S1000-2M
Surface Finish: ENIG
Board Thickness: 3.6mm
Minimum Hole: 0.25mm
Line Width & Space:9.8/9.5mil
Special Technology: Heavy copper（inner and outer layer 4OZ）

Heavy Copper Board

Layers: 12
Material: FR-4
Surface Finish: ENIG
Sheet thickness: 4.0mm
Line Width & Space: 6.9/11mil
Minimum Hole: 0.35mm
Special Technology: High TG and Heavy Copper, inner and outlayer are 4OZ

HDI board

Layers: 20
Material: FR-4 EM370
Surface Finish: Hard Gold
Board Thickness: 5.5mm
Minimum Hole: 0.25mm
Line Width & Space: 3 / 3mil
Special Technology: 4-step HDI, Hard Gold thickness 30U"

HDI Board

Layers: 3
Material: Rogers4350+ Metal Base
Surface Finish: ENIG+Hard Gold
Board Thickness: 1.6mm
Minimum Hole: 0.25mm
Line Width & Space: 5 / 5mil
Special Technology: Metal Base, 2 StepHDI, Impedance, Depth Milling

Hybrid Board

Layers: 3
Material: F4BME+RoGERS4450
Surface Finish: ENIG
Board Thickness: 3.2mm
Minimum Hole: 0.3mm
Line Width & Space: 5 / 5mil
Special Technology: Hybrid, Step board, Half hole, Edge plating, Depth Milling

Flex-rigid

Layers: 4
Meterial: FR-4+SF202
Surface Finish: ENIG
Board Thickness: 1mm
Minimum hole: 0.2mm
Line Width & Space: 4 / 4mil
Special Technology: Flex-rigid, edge plating

Server board

Layers: 12layers
Boards thickness: 2.0mm
Dimensions: 340*400mm
Main control package: Dual-channel BGA-1024
Minimun component: 0201
Component Qty: 9000+
Process features: Dense components on the top side, numerous BGAs/QFPs, POP assembly process, heat sink assembly.

8.0 Thickness Board

Layers: 4
Material: FR-4 VT-42
Surface Finish: ENIG
Board Thickness: 8mm
Minimum Hole: 0.5mm
Line Width & Space: 10 / 10mil
Special Technology: 8.0 Board Thickness, Counter Sink Hole， Stiffener

Antenna Board

Layers: 6
Material: FR-4
Surface Finish: Immersion Silver
Board Thickness: 2.2mm
Line Width & Space: 7.5 / 4mil
Special Technology: Impedance

Communication Board

Layers: 16
Material: FR-4 S1000-2M
Surface Finish: ENIG
Board Thickness: 4.0mm
Minimum Hole: 0.45mm

Line Width & Space: 10 / 10mil

Special Technology: Lower Resistance

Computer Board

Layers: 8
Material: FR-4
Surface Finish: ENIG
Board Thickness: 1.6mm
Line Width & Space: 9 / 4.5mil
Special Technology: Impedance

Consumer Board

Layers: 6

Material: FR-4
Surface Finish: OSP
Board Thickness: 1.0mm
Minimum Hole: 0.25mm
Line Width & Space: 3.5 / 3.5mil

Industrial Board

Layers: 2

Material: FR4
Surface Finish: ENIG
Board Thickness: 2.0mm
Copper thickness: 1OZ
Special Technology: ENIG for whold bottom side

Industrial Board

Layers: 14
Material: FR-4
Surface Finish: ENIG
Board Thickness: 2.0mm
Line Width Space: 4.3 / 3.5mil
Special Technology: Impedance

Medical Board

Layers: 8
Material: FR-4
Surface Finish: ENIG
Board Thickness: 2.0mm
Line Width & Space: 4.7 / 3.5mil
Special Technology: Impedance

Medical Board

Layers: 10
Material: FR-4 / High Tg
Surface Finish: ENIG
Board Thickness: 2.0mm
Line Width & Space: 5.4 / 3.5mil
Special Technology: Impedance

Computer board

Layers: 14layers
Boards thickness: 1.6mm
Dimensions: 275*120mm
Main control package: BGA-256
Minimun component: 0402
Component Qty: 3600+
Process features: Top-side BGA, assembly process, gold finger protection, POP assembly process,THT through-hole reflow process.
工艺特点: 正面BGA贴装工艺, 金手指防护, POP贴装工艺, THT通孔回流工艺

Computer board

Layers: 8layers
Boards thickness: 1.6mm
Dimensions: 290*130mm
Main control package: BGA-256
Minimun component: 0201
Component Qty: 6100+
Process features: Dense IC components on the top side,numerous BGAs/QFPs, POP assembly process,THT through-hole reflow process.
工艺特点: 正面IC元件密集,BGA/QFP多,POP贴装工艺,THT通孔回流工艺

Communication module board

Layers: 8layers
Boards thickness: 1.0mm
Dimensions: 150*150mm
Main control package: FBGA-900
Minimun component: 0201
Component Qty: 800+
Process features: Dense components on both side, numerous BGAs, CNC board separation.
工艺特点: 双面元器件密集, BGA多, CNC分板

Hybrid Board

Layers：6
Material：TU872+R4350
Surface Finish：ENIG
Board Thickness：2.4mm
Minimum Hole: 0.25mm
Line Width & Space：5.9/6.0mil
Special Technology: Hybrid, Depth Milling

Hybrid Board

Layers: 4
Material: Rogers 4350+FR-4
Surface Finish: ENIG
Board Thickness: 1.2mm
Minimum Hole: 0.2mm
Special Technology: Hybrid

HDI Board

Layers: 8
Material: FR-4
Surface Finish: ENIG
Board Thickness: 2.5mm
Minimum Hole: 0.3mm
Line Width & Space: 6 / 6mil
Special Technology: 1 Step HDI, Heavy Copper(3oz), Depth Milling

HDI board

Layers: 12
Meterial: FR-4
Surface Finish: ENIG
Board Thickness: 3mm
Minimum hole: 0.35mm
Line Width & Space: 9 / 9mil
Special Technology: 1 Step HDI, Heavy copper (inner layer 4OZ, outer layer 2OZ)

HDI Board

Layers: 12
Material: Panasonic M6
Surface Finish: ENIG
Board Thickness: 1.6mm
Minimum Hole: 0.2mm
Line Width & Space: 3/3mil
Special Technology: 1 Step HDI

Super Long Board

Layers: 8

Mertail: FR-4

Surface Finish: ENIG
Board Thickness: 2mm
Minimum Hole: 0.2mm
Line Width & Space: 4 / 4mil
Special Technology: Long Board(191*996.1mm), Impedance, space between drill to trace 6mil(inner layer)

Thermoelectric Separation Board

Layers: 2
Material: Copper base+ST115B
Surface Finish: ENIG
Board Thickness: 3.2mm
Minimum Hole: 1.6mm
Line Width & Space: 8 / 8mil
Special Technology: Metal Base, Thermoelectric Separation

Flex-rigid

Layers: 6
Material: FR4+Panasonic R-777
Surface Finish: ENIG
Board Thickness: 1.6mm
Minimum hole: 0.2mm
Line Width & Space: 4 / 4mil
Special Technology: Flex-rigid

Flex-rigid

Layers: 6
Material:FR-4+SF202
Surface Finish: ENIG
Board Thickness: 1mm
Minimum hole: 0.1mm
Line Width & Space: 2.9 / 2.9mil
Special Technology: Rigid-Flex, 1 Step HDI, Step holes, Bevel, Impedance

넳 넲