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Server board

Layers: 12layers
Boards thickness: 2.0mm
Dimensions: 340*400mm
Main control package: Dual-channel BGA-1024
Minimun component: 0201
Component Qty: 9000+
Process features: Dense components on the top side, numerous BGAs/QFPs, POP assembly process, heat sink assembly.

Product Details

Surface finishes： HASL (LF), ENlG, lmmersion Tin, lmmersion silver, Golden finger, Full board with hard gold plating, OSP, ENEPlG, Selective hard gold plating.

Regular materials： FR-4 TG150/TG170, Rogers, Arlon, Taconic, TUC TU-872 SLK, TU-883,Panasonic M6/M7, Bergguist etc.

Special technologies： Blind & buried vias, POFV, edge plating, castellated holes, step mounting holes, controlled depth holes, metal based (core), step gold finger, back drill,partial hybrid pressing, bus bar, embedded coin, embedded ceramic etc.

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Boards thickness: 2.0mm
Dimensions: 340*400mm
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Minimun component: 0201
Component Qty: 9000+
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Minimun component: 0402
Component Qty: 3600+
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工艺特点: 正面BGA贴装工艺, 金手指防护, POP贴装工艺, THT通孔回流工艺

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Layers: 8layers
Boards thickness: 1.6mm
Dimensions: 290*130mm
Main control package: BGA-256
Minimun component: 0201
Component Qty: 6100+
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Layers: 8layers
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Surface Finish: ENIG
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