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Computer board

Layers: 8layers
Boards thickness: 1.6mm
Dimensions: 290*130mm
Main control package: BGA-256
Minimun component: 0201
Component Qty: 6100+
Process features: Dense IC components on the top side,numerous BGAs/QFPs, POP assembly process,THT through-hole reflow process.
工艺特点: 正面IC元件密集,BGA/QFP多,POP贴装工艺,THT通孔回流工艺

Product Details

Surface finishes： HASL (LF), ENlG, lmmersion Tin, lmmersion silver, Golden finger, Full board with hard gold plating, OSP, ENEPlG, Selective hard gold plating.

Regular materials： FR-4 TG150/TG170, Rogers, Arlon, Taconic, TUC TU-872 SLK, TU-883,Panasonic M6/M7, Bergguist etc.

Special technologies： Blind & buried vias, POFV, edge plating, castellated holes, step mounting holes, controlled depth holes, metal based (core), step gold finger, back drill,partial hybrid pressing, bus bar, embedded coin, embedded ceramic etc.

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Main control package: BGA-256
Minimun component: 0402
Component Qty: 3600+
Process features: Top-side BGA, assembly process, gold finger protection, POP assembly process,THT through-hole reflow process.
工艺特点: 正面BGA贴装工艺, 金手指防护, POP贴装工艺, THT通孔回流工艺

Computer board

Layers: 8layers
Boards thickness: 1.6mm
Dimensions: 290*130mm
Main control package: BGA-256
Minimun component: 0201
Component Qty: 6100+
Process features: Dense IC components on the top side,numerous BGAs/QFPs, POP assembly process,THT through-hole reflow process.
工艺特点: 正面IC元件密集,BGA/QFP多,POP贴装工艺,THT通孔回流工艺

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Layers: 8layers
Boards thickness: 1.0mm
Dimensions: 150*150mm
Main control package: FBGA-900
Minimun component: 0201
Component Qty: 800+
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Flex-rigid

Layers: 6
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Board Thickness: 1.6mm
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Material:FR-4+SF202
Surface Finish: ENIG
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