Communication.Board

Communication.Board

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Communication Board

Layers: 16
Material: FR-4 S1000-2M
Surface Finish: ENIG
Board Thickness: 4.0mm
Minimum Hole: 0.45mm

Line Width & Space: 10 / 10mil

Special Technology: Lower Resistance

Product Details

Surface finishes： HASL (LF), ENlG, lmmersion Tin, lmmersion silver, Golden finger, Full board with hard gold plating, OSP, ENEPlG, Selective hard gold plating.

Regular materials： FR-4 TG150/TG170, Rogers, Arlon, Taconic, TUC TU-872 SLK, TU-883,Panasonic M6/M7, Bergguist etc.

Special technologies： Blind & buried vias, POFV, edge plating, castellated holes, step mounting holes, controlled depth holes, metal based (core), step gold finger, back drill,partial hybrid pressing, bus bar, embedded coin, embedded ceramic etc.

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